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Table of Contents
Executive Summary
Methodology
China Semiconductor Industry Overview
*Government Policies
*China Semiconductor Market
*China’s Role in the Global Semiconductor Industry
Semiconductor Value Chain in China
*IC Design
Design Capability
EDA Tools and IP Usage Status
Foundry Tape Out Status
Drivers
Barriers
*Foundry
Foundry Map
Foundry Capacity
China’s Leading Foundries
Relationship with IC Design Companies
Drivers
Barriers
*Test & Packaging
Investment Status
Production Capacity
Drivers
Barriers
*China IDM Status
Top Ten International IDMs in China
Local IDMs
Forecast
*Opportunities and Challenges
*Market Forecast
*China IC Industry Revenue Forecast.
IC Design Industry Forecast
Foundry Industry Forecast
Test & Packaging Industry Forecast
Profiles
*Top Ten International IDMs in China
Intel
Samsung
TI
Infineon
Toshiba
Philips
Hynix
STMicroelectronics
Freescale
AMD
*Local IDMs
Shanghai Belling
Hangzhou Silan Microelectronics Co. Ltd
Nanker Group
Wu’Xi China Resources Huajing Micro Electronics Co. Ltd
*Top IC Design Companies
DMT
Actions Semiconductor
HED
Spreadtrum
Vimicro
*Top Foundry Firms
SMIC
GSMC
HHNEC
HeJian
ASMC
*Top Test & Packaging Facilities
NanTong Fujitsu
RF Micro
Jiangsu Changjiang Electronics Technology Co. Ltd

List of Tables
Table 1. China Semiconductor Market Breakdown, 2002–2004 (US$ in Billions)
Table 2. China’s Top Ten IC Design Companies, 2004
Table 3. Worldwide Costs of Building a Fab, 1983–2003 (US$ in Millions)
Table 4. China’s Foundry Firms Capacity, Current and Planned for 2006
Table 5. China’s Top Ten Foundry Firms, 2004
Table 6. China’s Top Ten Test & Packaging Facilities, 2004
Table 7. China’s Major Digital TV Chip Vendors, 2005
Table 8. China Semiconductor Market Forecast, 2005–2009 (US$ in Billions)
Table 9. China IC Industry Forecast, By Sector, 2005–2009

List of Figures
Figure 1. China’s Main Governmental Policies towards Semiconductor Industry (Since 1980)
Figure 2. Driving the Development of Technology
Figure 3. Semiconductor Market Share Breakdown: China vs. Global, 2004
Figure 4. China Semiconductor Industry Structure
Figure 5. China Semiconductor Supply Chain
Figure 6. China IC Industry Revenue Structure, 2002–2004 (US$ in Millions)
Figure 7. China’s IC Design Companies Geographical Distribution, 2005
Figure 8. 2005 Annual Revenue for China’s IC Design Companies
Figure 9. R&D Engineering Numbers for IC Design Companies, 2005
Figure 10. China’s IC Design Companies Application Areas, 2005
Figure 11. China’s IC Design Companies Design Proficiency, 2005
Figure 12. China’s IC Design Companies Design Scale (Number of Logic Gates), 2005
Figure 13. Difficulties in EDA Tool Deployment, 2005
Figure 14. China’s IC Design Companies EDA Tools Selection, 2005
Figure 15. IP Usage Status of China’s IC Design Companies, 2005
Figure 16. IP Expenditure in Total R&D Cost, 2005
Figure 17. Source and Type of Third-Party IP Acquired by IC Design Companies, 2005
Figure 18. Foundry Selection by Country, 2005
Figure 19. Difficulties Facing China’s IC Design Companies, 2005
Figure 20. Numbers of Fabs in Operation in China, 2004
Figure 21. Foundry Selection of IC Design Companies in 2005
Figure 22. Geographical Distribution of China’s Test & Packaging Companies, 2005
Figure 23. Source of Capital for China’s Test & Packaging Companies, 2005
Figure 24. Investments into China’s Test & Packaging Companies (US$ in Millions)
Figure 25. Production Capacity of China’s Test & Packaging Companies, 2005
Figure 26. SMIC Fab Construction Status, 2004–2005
Figure 27. GSMC Logic Technology Roadmap, 2003–2006
Figure 28. GSMC Flash Memory & Embedded Flash Technology Roadmap, 2003–2006
Figure 29. Process Technology Roadmap of HHNEC, pre-2004–2007
Figure 30. HeJian’s Technology Roadmap, 2004–2007
Report's synopsisAbstract
The driving government force in China’s semiconductor industry is gradually being surpassed by market demand: China’s domestic semiconductor demand will increase at a CAGR of 21.0% y-o-y growth in 2005–2009. Due to the greatly improved desktop PC and notebook production capability of Chinese companies, computers are still the largest semiconductor application area with a share of 39.5% in China’s IC market, even though it lags behind the global market share. Market share of semiconductors for consumer electronics remains high and is 13% higher than the global market. Vast demand will continue in this sector in the next few years.
In the communications field, the proposed issuing of 3G licenses will bring new opportunities in the telecommunications sector. Short-distance wireless technologies like ZigBee, UWB, and Bluetooth2.0 will see space for development. The implementation of Digital Home is another sector that will boost consumer electronics and the wireless market.
In China’s semiconductor value chain, China’s top ten IC design companies received 45.2% of China’s total IC design industry revenue in 2004. Traditionally, test and packaging revenue accounted for over 70% of the total semiconductor industry revenue. However, as new international level foundries like SMIC and GSMC build up, semiconductor manufacturing is gradually becoming the main force behind China’s semiconductor industry. 
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